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M31’s IP Solutions of TSMC 28HPC+/ 22ULP/22ULL Process Technology

Overview

TSMC’s 28nm process technology features high performance and low power consumption advantages and supports a wide range of applications. The process mainly uses High-k Metal Gate (HKMG) gate-last technology, which consumes lower leakage current and performs much better results.

22nm ultra-low power (22ULP) and ultra-low leakage (22ULL) are derived as an optical shrink from 28nm platform and offer various options for a broad range of designs.

Compared to 28nm high-performance compact (28HPC) technology, 22ULP provides 10% area reduction with more than 30% speed gain or more than 30% power reduction for applications, like image processing, digital TVs, set-top boxes, smartphones, and consumer products, etc.

New ULL device and ULL SRAM consume lower power in comparison with 40ULP and 55ULP. 22ULL technology provides significant power reduction crucial for designs in IoT and wearables market segments.

With regards to this platform, M31 has developed comprehensive IP solutions to assist customers with SoC designs including standard cell library, SRAM compiler, ONFi IO, LPDDR3, EMMC/SD IO, USB, PCIe, MIPI, PLL, etc.

Highlights

Abundant IP solutions with competitive PPA on TSMC 28HPC+/22ULP/22ULL platform

  • Foundation IP

Standard cell, Memory compiler(SRAM, ROM), ONFi, LPDDR3, SD/eMMC IO.

  • Interface IP

USB, SerDes,PCIe, MIPI .

  • Analog IP

PLL, POR

M31 IP Solutions

 

Brief summary table is as below. Please refer to M31 latest IP catalog for details.

The checkmarks of the table may indicate  “Silicon Proven”, “Design Kit Ready” or “Under Development”.

Please contact sales@m31tech.com.

M31 Latest IP Catalog

Please contact sales@m31tech.com.
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