Technical Bulletin Download




  • M31 6.5-Track Ultra High Density Standard Cells on 22/28nm
  • M31 Embedded SRAM Optimized for various SOCs to enable Diverse Applications
  • M31 General-Purpose IO and Special IO



  • M31 PHY and 3rd party controller integration solution
  • M31 USB 4.0 Gen3X2 and DP1.4 X4 PHY IP with Type-C connector support
  • M31 DDR4/LPDDR4/LPDDR4X PHY
  • M31 PCIe 5.0 PHY IP for Storage and High-Bandwidth Connection
  • M31 MIPI D-PHY and D-PHY/C-PHY Combo for Camera and Display in Mobile Devices
  • M31 Highly Competitive PCIe PHY in High-Performance Computing Arena
  • M31 USB 3.2 G2/3.2 G1/2.0 PHY IP for Host and Device Applications
  • M31 USB PHY BCK for Low-Cost, Low-Power and Compact Chip Size Applications
  • 31 MIPI M-PHY for Mobile Devices and Automotive



  • M31 IP Portfolio for Digital Storage Applications
  • M31 IP Portfolio for IoT Applications
  • M31 IP Portfolio of Automotive Applications
  • M31 IP Portfolio for Artificial Intelligence Applications



  • IP Integration Service- M31 Processor Core Hardening Service
  • IP Integration Service- M31 Processor Hard Core
  • M31 Data Converter IP for Industrial, Automotive, Communication and Consumer Product Applications- 10/12-Bit, 5-MSPS Single-Ended/Differential SAR-ADC in 12/16/22 nm Process
  • M31 Ultra-Low-Power Fractional-N PLL IP
  • M31 Low-Power Design Approaches along with IP Solutions
  • M31 PVT Sensor IP for Environment Sensing
  • M31’s Comprehensive Physical IP Portfolio on TSMC 22ULP/22ULL Technology Platform